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[1]江学良,杨浩,王维,等.铜粉表面化学镀银及表征[J].武汉工程大学学报,2013,(11):37-42.[doi:103969/jissn16742869201311009]
　JIANG Xue\|liang,YANG Hao,WANG Wei,et al.Characterization of chemical silver plating on surface of copper powder[J].Journal of Wuhan Institute of Technology,2013,(11):37-42.[doi:103969/jissn16742869201311009]
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铜粉表面化学镀银及表征(/HTML)
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《武汉工程大学学报》[ISSN:1674-2869/CN:42-1779/TQ]

卷:
期数:
2013年11
页码:
37-42
栏目:
资源与土木工程
出版日期:
2013-11-30

文章信息/Info

Title:
Characterization of chemical silver plating on surface of copper powder
文章编号:
16742869(2013)11003706
作者:
江学良1; 杨浩1; 王维1; 陈乐生2
1.武汉工程大学材料科学与工程学院， 湖北 武汉 430074；2.温州宏丰电工合金股份有限公司， 浙江 温州 325603
Author(s):
JIANG Xue\|liang1;  YANG Hao1;  WANG Wei1;  CHEN Le\|sheng2
1.School of Material Science and Engineering, Wuhan Institute of Technology, Wuhan 430074, China;2. Wenzhou Hongfeng Electrical Alloy Co., Ltd. Wenzhou 325603, China
关键词:
银\|铜复合粉; 敏化; 还原; 化学镀银; 微米颗粒
Keywords:
silver\|copper composite powder; sensitized; deoxidization; electro\|less silver plating; micros\|particles
分类号:
TB33
DOI:
103969/jissn16742869201311009
文献标志码:
A
摘要:
铜\|银复合粉末具有良好的抗氧化性、热稳定性及高电导性，在电子浆料、导电填料等众多领域具有广阔的应用前景.利用化学镀的方法，采用氯化亚锡为敏化剂，甲醛为还原剂，合成了用于电子浆料的铜\|银复合粉末.用X射线衍射、扫描电镜表征了复合粒子的晶型和形貌结构，研究了敏化剂氯化亚锡、反应温度、还原剂及镀液的pH值对材料晶型和形貌的影响.结果表明：采用甲醛为还原剂，经过敏化处理后，当镀液pH值为10时，在50 ℃下，合成的银包铜粉电接触材料有较好的形貌.
Abstract:
Silver coated copper powders has a wide application in the electronic paste, conductive filler,and other fields because of its good oxidation resistance, thermal stability and high conductivity. Silver\|copper composite powders were synthesized by chemical plating method in which the stannous chloride and formaldehyde were used as sensitizer and reducing agent, respectively. X\|ray diffraction and scanning electron microscopy were used to characterize the morphology and crystalline structure of the composite particles. The effects of sensitizer stannous chloride, reaction temperature, reducing agent and pH value of solution on the surface and crystal morphologies of the composite particles were investigated. The results show that using formaldehyde as a reducing agent with the post\|treatment of sensitization, the silver\|plated copper powders with well morphology can be obtained when the pH value of solution is 10 and the reaction temperature is kept around 50 ℃.

参考文献/References:

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备注/Memo

备注/Memo:
收稿日期：20130830基金项目：湖北省自然科学基金(2011CBD220)；2013武汉工程大学研究生创新基金项目（CX201237）作者简介：江学良（1972\|），男，安徽肥东人，副教授，博士.研究方向：有机-无机杂化材料与功能高分子.
更新日期/Last Update: 2013-12-03