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[1]罗国强,尹凯,王仪宇.铜薄膜作中间层的镁铝扩散焊接[J].武汉工程大学学报,2012,(8):62-66.[doi:103969/jissn16742869201208016]
 LUO Guo qiang,YIN Kai,WANG Yi yu.Diffusion bonding of magnesium alloy and aluminum alloy using copper film as interlayer[J].Journal of Wuhan Institute of Technology,2012,(8):62-66.[doi:103969/jissn16742869201208016]
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铜薄膜作中间层的镁铝扩散焊接
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《武汉工程大学学报》[ISSN:1674-2869/CN:42-1779/TQ]

卷:
期数:
2012年8期
页码:
62-66
栏目:
资源与土木工程
出版日期:
2012-09-10

文章信息/Info

Title:
Diffusion bonding of magnesium alloy and aluminum alloy using
copper film as interlayer
文章编号:
16742869(2012)08006205
作者:
罗国强尹凯王仪宇
武汉理工大学材料复合新技术国家重点实验室,湖北 武汉430070
Author(s):
LUO Guoqiang YIN Kai WANG Yiyu
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing,
Wuhan University of Technology, Wuhan 430070, China
关键词:
铜薄膜扩散焊接镁合金铝合金磁控溅射技术
Keywords:
copper film diffusion bonding Mg alloy Al alloy magnetron sputtering technique
分类号:
TB31
DOI:
103969/jissn16742869201208016
文献标志码:
A
摘要:
采用磁控溅射技术在变形镁合金表面沉积铜薄膜,将其作为中间层对变形镁合金和硬铝合金进行了低温扩散焊接研究.利用超声波显微镜、X射线衍射、扫描电镜、电子探针等对焊接接头界面区域的显微结构及物相等进行了研究.研究结果表明,在镁合金基体上沉积的Cu薄膜主要以(111)、(200)晶向上生长,薄膜表面平整、均匀、致密;在扩散焊接工艺条件焊接温度T=455 ℃、保温时间t=90 min、压力P=3 MPa下获得了质量较好的Mg/Al焊接接头.焊接接头界面区域由铝镁原子比分别为3∶2,1∶1,12∶17 三层镁铝系金属间化合物构成,接头断裂破坏发生在镁铝系化合物层,断口呈现明显的脆性断裂特征.
Abstract:
MB2 magnesium alloy and LY12 aluminum alloy were successfully jointed through diffusion bonding method at quite low temperature by using Cu film as interlayer which was deposited on MB2 alloy surface by Magnetron Sputtering technique. Scanning Acoustic Microscopy, Scanning Electron Microscope, XRay Diffraction, Electron Probe Micro Analyzer were used to investigate the microstructures and phases in the interfaces of the joints. The experiment results show that smooth and dense Cu film grew up in (111), (200) crystal orientation on MB2 maganesum alloy substrate. High quality MB2/LY12 joint are prepared under the diffusion bonding process: temperature of 455 ℃, holding time for 90 min, pressure of 3 MPa. The joint interfaces consist of three different MgAl intermetallic compounds which are Al3Mg2, AlMg and Al12Mg17, respectively. The fracture failure of the joints takes place between MgAl compound layers and the fracture surfaces exhibit typical brittle failure feature.

参考文献/References:

[1]黄伯云.我国有色金属材料现状及发展战略\[J\].中

国有色金属学报,2004,14(5): 122127.
[2]张少华.铝合金在汽车上应用的进展\[J\].汽车工业研究,2003(3) :3639.
[3]Mordike B L. Magnesium: propertiesapplicationspotential \[J\]. Materials Science and Engineering A, 2001, 302(1):3745.
[4]王军,冯吉才.镁铝异种金属焊接研究现状与进展\[J\].焊接,2007(9):1519.
[5]刘鹏,李亚江,王娟. Mg/Al异种材料真空扩散焊界面区域的显微组织\[J\].焊接学报,2004,25(5): 59.
[6]Liu Peng, Li Yajiang, Geng Haoran, et al. A study of phase constitution near the interface of MgAl vaccum diffusion bonding \[J\]. Materials Letters, 2005, 59(16): 20012005.
[7]Zhao L M, Zhang Z D. Effect of Zn alloy interlayer on interface microstructure and strength of diffusionbonded MgAl joints \[J\]. Scripta Materialia, 2008,58:283286.
[8]Liu L M, Zhao L M, Xu R Z. Effect of interlayer composition on the microstructure and strength of diffusion bonded Mg/Al joint \[J\].Materials and Design,2009,30:45484551.

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备注/Memo

备注/Memo:
收稿日期:20120621基金项目:国家自然科学基金项目(11072228);武汉理工大学自主创新基金项目(2011-IV-038)作者简介:罗国强(1980),男,湖北大冶人,副研究员,博士.研究方向:功能梯度复合材料,金属焊接和粉末冶金制备新技术.
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